Description

In the field of materials testing, other methods can be used in addition to infrared thermography in order to analyse, for example, displacements and mechanical deformations of material samples and components parallel to thermal changes. Together with GOM InfraTec presents the possibilities of thermographic measurement and digital image correlation.

ARAMIS enables with its digital image correlation (DIC) functionalities the analysis of displacements and mechanical deformations of material specimens and components. In combination with thermography measurements, the thermal specimen behavior can be evaluated together with the mechanical deformation.

With the unique software feature in ARAMIS, you can analyze the correlation between mechanical and thermal deformations in detail and speed up your development time thanks to the comprehensive understanding obtained about your materials or components.

Agenda

09:00 - 10:00

  • Registration and Welcome Coffee


10:00 - 18:00

  • Introduction to optical metrology
  • Solution for materials and component testing
  • Practical applications & user experience
  • Help with individual questions
  • Networking opportunities & evening event

Registration

Date: November 13th 2019

Time: 09:00 - 18:00

City: Shanghai, China

If you already have any questions about the parallel application of both measurement methods, we will be pleased to assist you. Feel free to call us on +49 351 871-8630 or send us a message using the contact form.

We are looking forward to your participation!